Shenzhen CGE Electronics Co.,Ltd
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(Total 6 Products for Shenzhen Pull Out Underlay Connector)
H2.0 Pull-out underlay FPC connector
SPECIFICATION
Rated Current :0.5A
Contact Resistance:30mQMax
Insulation Resistance :500MQ Withstand Voltage : 500VAC/DC Operation Temperature:-40°c to +105°c
material:
Housing:High-temperature material
Terminal:Copper alloy The pull-out underslung connector is an electrical connector commonly used in power systems. It...
SMT Right angle type pull-out FPC Connector
Product Name:SMT Right angle type pull-out FPC Connector FPC translated into Chinese is: flexible printed circuit board, commonly known as the PCB made of soft materials (can be folded, bent material); connectors for LCD display to drive the circuit (PCB) connection, mainly 0.5mm pitch products. 0.3mm pitch products...
Professional production of pull down top connectors
SPECIFICATION
Rated Current :0.5A
Contact Resistance :30mQ Max
Insulation Resistance :500MQ Min
Withstand Voltage : 500VAC/DC
Operation Temperature :-40c to +105°c
material:
Housing:High-temperature material Terminal:Copper alloy The pull-out prone connector is a common type of electronic connector which features a...
H2.0 Pull-out top FPC connector
SPECIFICATION
Rated Current :0.5A
Contact Resistance:30mQMax
Insulation Resistance :500MQ Withstand Voltage : 500VAC/DC Operation Temperature:-40°c to +105°c
material:
Housing:High-temperature material
Terminal:Copper alloy The FPC connector, or flexible circuit board connector, is a connection tool for connecting...
DIP Vertical type straight plug Wafer Connector
Product Name:DIP Vertical type straight plug Wafer Connector A wafer connector is used to electrically connect a wafer and comprises: a base with several terminal slots spaced apart, a placement area for the wafer at the upper end of the base, a snap arm at the front end of the base, the snap arm having a snap...
SMT Right angle type lying paste Wafer Connector
Product Name:SMT Right angle type lying paste Wafer Connector A wafer connector is used to electrically connect a wafer and comprises: a base with several terminal slots spaced apart, a placement area for the wafer at the upper end of the base, a snap arm at the front end of the base, the snap arm having a snap...
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